palladium nickel plating
Palladium-Nickel (PdNi) alloy deposits provide not only an alternative to gold plating on connectors and circuit boards, but can also serve as a performance enhancement when used in combination with gold. When Palladium-Nickel is used as an underplate to the gold plating, a thinner gold “Flash
ASTM B867 Electrodeposited Coatings of Palladium-Nickel for Engineering Use
Deposit thickness may be specified in micrometers (μ m) ranging from Class 0.4 to Class 3.0.
Most common range is Class is 0.5 (approx. 20μ
*75% Pd / 25% Ni
80% Pd / 20% Ni
*85% Pd / 15% Ni
*90% Pd / 10% Ni
*Note: Cal-Aurum Industries currently offers only Type II PdNi, which ranges from 75-85% Pd.