palladium nickel plating
Palladium-Nickel (PdNi) alloy deposits provide not only an alternative to gold plating on connectors and circuit boards, but can also serve as a performance enhancement when used in combination with gold. When Palladium-Nickel is used as an underplate to the gold plating, a thinner gold “Flash” may be used while maintaining the same level electrical conductivity, and at the same time, improving the overall wear resistance.
ASTM B867 Electrodeposited Coatings of Palladium-Nickel for Engineering Use
Deposit thickness may be specified in micrometers (μ m) ranging from Class 0.4 to Class 3.0.
Most common range is Class is 0.5 (approx. 20μ ” minimum) to Class 1.3 (approx. 51μ ”)
*75% Pd / 25% Ni
80% Pd / 20% Ni
*85% Pd / 15% Ni
*90% Pd / 10% Ni