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Copper
plating can be used as a heat treatment stop-off shield, carburizing or
decarburizing shield, an undercoat for nickel and other metals, or to
prevent base metal migration into a tin layer. Copper in color and matte
to a very shiny finish, it has good corrosion resistance when used as
an undercoat. Several copper processes are available, each designed for
a specific purpose: Bright, to eliminate buffing; High Speed, for electroforming;
Fine Grain, to prevent case hardening, etc.
Specification:
MIL-C-14550 Copper Plating, Electrodeposited (This spec has been cancelled,
but is still in wide use.)
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Thickness
Classes: |
0 |
0.00100-0.00500
inch thick |
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|
1 |
0.00100
inch thick |
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|
2 |
0.00050
inch thick |
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|
3 |
0.00020
inch thick |
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|
4 |
0.00010
inch thick |
Specification:
ASTM B 734 Standard Specification for Electrodeposited Copper for Engineering
Uses
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Thickness
Classes: |
25 |
25µ"
minimum |
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20 |
20µ"
minimum |
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12 |
12µ"
minimum |
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5 |
5µ"
minimum |
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|
x |
Thickness
specified |
Specification:
AMS 2418 Plating, Copper
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Type-1 |
Engineering |
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Type-2 |
For
masking |
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