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Copper plating can be used as a heat treatment stop-off shield, carburizing or decarburizing shield, an undercoat for nickel and other metals, or to prevent base metal migration into a tin layer. Copper in color and matte to a very shiny finish, it has good corrosion resistance when used as an undercoat. Several copper processes are available, each designed for a specific purpose: Bright, to eliminate buffing; High Speed, for electroforming; Fine Grain, to prevent case hardening, etc.

•Specification: MIL-C-14550 Copper Plating, Electrodeposited (This spec has been cancelled, but is still in wide use.)

  Thickness Classes: 0 0.00100-0.00500 inch thick
    1 0.00100 inch thick
    2 0.00050 inch thick
    3 0.00020 inch thick
    4 0.00010 inch thick

•Specification: ASTM B 734 Standard Specification for Electrodeposited Copper for Engineering Uses

  Thickness Classes: 25 25µ" minimum
    20 20µ" minimum
    12 12µ" minimum
    5 5µ" minimum
    x Thickness specified

•Specification: AMS 2418 Plating, Copper

  Type-1 Engineering
  Type-2 For masking

 

 

 

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