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Silver plating intended for engineering purposes is usually employed for solderable surfaces, electrical contact characteristics, high electrical and thermal conductivity, thermocompression bonding, wear resistance of load-bearing surfaces, and spectral reflectivity.

•Specification: QQ-S-365 Silver Plating, Electrodeposited (This spec has been cancelled, but is still in wide use.)

  Type-I Matte finish
  Type-II Semi-Bright finish
  Type-III Bright finish
       
 
Grade
A With supplementary tarnish-resistant treatment (chromate treatment)
 
Grade
B Without supplementary tarnish-resistant treatment
       
  Thickensses: • 0.0003" For articles such as terminals which are to be soldered
    • 0.0005" For corrosion protection of nonferrous basis metals or for increasing the electrical conductivity of basis metals
    • 0.0050"-0.0100" For electrical contacts, depending on pressure, friction and electrical load

•Specification: ASTM B 700 Electrodeposited Coatings of Silver for Engineering Use

  Type-1 99.9% silver minimum
  Type-2 99.0% silver minimum
  Type-3 98.0 % silver minimum
       
  Grades: A Matte, no brighteners in plating bath
    B Bright, by use of brighteners in plating bath
    C Bright, by mechanical or chemical polishing of Grade-A
    D Semibright, by use of brighteners in plating bath
       
  Classes: N No chromate treatment
    S With supplementary tarnish-resistant chromate treatment

•About solderability & tarnish-resistance: Silver plating with chromate-type supplementary dips have a low contact resistance in the order of 300 to 400 microhms per square inch. The items must be solderable with rosin cored solder.

•About corrosion protection: For applications where corrosion protection is important, the use of an electrodeposited nickel undercoat is advantageous.

•About Undercoating: a) Silver plating on steel, zinc and zinc-based alloys should have an undercoat of nickel over copper. b) Silver plating on copper and copper alloys should have a nickel undercoat. Copper and copper alloy material on which a nickel undercoat is not used, and other basis metals where a copper undercoat is employed, should not be used for continuous service at a temperature in excess of 300 degrees F (149 degrees C). Adhesion of the silver plating is adversely affected because of the formation of a weak silver and copper intermetallic layer.

 

 

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