Tin/Lead Alloy plating is primarily used as a coating on electronic connector components, preventing corrosion and serves as a base for soldered applications. Deposit color is gray-white and ranges from matte to bright in appearance depending on the process used.
MIL-P-81728 Plating, Tin-Lead (Electrodeposited) (This canceled spec is still in wide use.)
ASTM B 579 Electrodeposited Coatings of Tin-Lead Alloy (Solder Plate)
Service Conditions (thicknesses):
Tin deposits are 50 to 70 percent by weight, other metals and non-metallics 1 percent maximum, with the remainder being lead. Other compositions may be specified with the percentage of tin no more than 10 percent from the specified nominal value.